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Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies

Title: | Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama |
Authors: | Lamovec, Jelena ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() |
Issue Date: | 2015 | Publication: | Tehnika | ISSN: | 0040-2176![]() ![]() |
Publisher: | Beograd, Srbija : Savez inženjera i tehničara Srbije | Type: | Article | Collation: | vol. 70 br. 6 str. 915-920 | DOI: | 10.5937/tehnika1506915L | URI: | https://cer.ihtm.bg.ac.rs/handle/123456789/1691 http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2928 https://enauka.gov.rs/handle/123456789/147029 |
Project: | Mikro, nano-sistemi i senzori za primenu u elektroprivredi, procesnoj industriji i zaštiti životne sredine (RS-32008) | M-category: | 51M51 |