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eNauka >  Results >  Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies
Title: Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies
Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama
Authors: Lamovec, Jelena  ; Jović, Vesna; Mladenović, Ivana  ; Popović, Bogdan  ; Radojević, Vesna  
Issue Date: 2015
Publication: Tehnika
ISSN: 0040-2176 Tehnika (Beograd) Search Idenfier
Publisher: Beograd, Srbija : Savez inženjera i tehničara Srbije
Type: Article
Collation: vol. 70 br. 6 str. 915-920
DOI: 10.5937/tehnika1506915L
URI: https://cer.ihtm.bg.ac.rs/handle/123456789/1691
http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2928
https://enauka.gov.rs/handle/123456789/147029
Project: Mikro, nano-sistemi i senzori za primenu u elektroprivredi, procesnoj industriji i zaštiti životne sredine (RS-32008)
M-category: 
51M51

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