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The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging
| Title: | The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging | Authors: | Mitić, Vojislav V.; Fleshman, Collin; Duh, Jenq-Gong; Ilić, Ivana D.   ; Lazović, Goran |
Issue Date: | 2021 | Publication: | Modern Physics Letters B | ISSN: | 0217-9849 Modern Physics Letters B Search Idenfier |
Publisher: | World Scientific Pub Co Pte Ltd | Type: | Article | Collation: | vol. 35 br. 33 str. 2150427 | DOI: | 10.1142/S0217984921504273 | WoS-ID: | 000722312100010 | Scopus-ID: | 2-s2.0-85117562501 | URI: | https://dais.sanu.ac.rs/123456789/12395 https://machinery.mas.bg.ac.rs/handle/123456789/3545 https://enauka.gov.rs/handle/123456789/157206 |
M-category: | 22M22 |
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