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Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes
| Title: | Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes | Authors: | Mladenović, Ivana   ; Bošković, Marko ; Lamovec, Jelena ; Vuksanović, Marija M. ; Nikolić, Nebojša D. ; Radojević, Vesna ; Vasiljević-Radović, Dana |
Issue Date: | 2021 | Publication: | Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021 | ISSN: | 2159-1679  Search Idenfier |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) | Type: | Conference Paper | ISBN: | 978-1-6654-4528-3 Search Idenfier |
Collation: | str. 165-168 | DOI: | 10.1109/MIEL52794.2021.9569036 | WoS-ID: | 001686589600034 | Scopus-ID: | 2-s2.0-85118463575 | URI: | https://enauka.gov.rs/handle/123456789/335794 https://cer.ihtm.bg.ac.rs/handle/123456789/4841 |
Project: | Ministarstvo prosvete, nauke i tehnološkog razvoja Republike Srbije, Ugovor br. 200026 (Univerzitet u Beogradu, Institut za hemiju, tehnologiju i metalurgiju - IHTM) (RS-200026) | M-category: | Mp. category will be shown later |
