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Thermodynamic analysis and characterization of Bi–Cu–Sn alloys as advanced lead-free solder materials for high temperature application
| Title: | Thermodynamic analysis and characterization of Bi–Cu–Sn alloys as advanced lead-free solder materials for high temperature application | Authors: | Živković, Dragana; Minić, Duško |
Issue Date: | 2010 | Publication: | Journal of Materials Science: Materials in Electronics | ISSN: | 0957-4522 Journal of Materials Science: Materials in Electronics Search Idenfier |
Type: | Article | Collation: | vol. 22 br. 8 str. 1130-1135 | DOI: | 10.1007/s10854-010-0272-y | WoS-ID: | 000292555200038 | Scopus-ID: | 2-s2.0-80051545470 | URI: | https://enauka.gov.rs/handle/123456789/344444 | Metadata source: | Migrirano iz RIS podataka | M-category: | 22M22 |
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