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| Title: | Account of the package features in modelling of thermal microsensors | Authors: | Kozlov, A.G.; Randjelović, Danijela   |
Issue Date: | 2013 | Publication: | 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experimen | Type: | Conference Paper | ISBN: | 978-1-4673-6139-2, 978-1-4673-6138-5 ИСБН није валидан Search Idenfier |
DOI: | 10.1109/EuroSimE.2013.6529923 | WoS-ID: | 000326869600034 | Scopus-ID: | 2-s2.0-84880976560 | URI: | https://cer.ihtm.bg.ac.rs/handle/123456789/1391 https://enauka.gov.rs/handle/123456789/481380 |
Project: | Mikro, nano-sistemi i senzori za primenu u elektroprivredi, procesnoj industriji i zaštiti životne sredine (RS-32008) | M-category: | Mp. category will be shown later |
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