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Application of the LabVIEW program package for control and monitoring process of reballing BGA chips
| Title: | Application of the LabVIEW program package for control and monitoring process of reballing BGA chips | Authors: | Radivojević, Milan D.   ; Miša Stević; Zoran Stević |
Issue Date: | 2018 | Publication: | 50 th International October Conference on Mining and Metallurgy | Publisher: | Mining and Metallurgy Institute Bor, Hotel "Jezero" Bor Lake, Serbia | Type: | Conference Paper | ISBN: | 978-86-7827-050-5  Search Idenfier |
Collation: | br. 50 str. 457-460 | URI: | https://enauka.gov.rs/handle/123456789/496593 | Metadata source: | Migrirano iz RIS podataka | M-category: | Mp. category will be shown later |
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