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Title: Parallel thermal analysis of hybrid and SMT modules using 2D and 3D models
Authors: Radojcic, Branka M; Ramovic, Rifat M; Aleksic, Obrad S
Issue Date: 2002
Publication: 2002 23RD INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS
Type: Conference Paper
Collation: str. 365-368
WoS-ID: 000176359700071
URI: https://enauka.gov.rs/handle/123456789/807611
Metadata source: (Preuzeto iz Nasi u WoS)
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