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Title: | Textile SIW structures without via holes using self-adhesive conductive tapes | Authors: | Nešić, Dušan ![]() ![]() ![]() ![]() ![]() ![]() |
Issue Date: | 2023 | Publication: | Proceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbia | Publisher: | Institute of Electrical and Electronics Engineers (IEEE) Niš, Serbia : Faculty of Electronic Engineering, University of Niš |
Type: | Conference Paper | ISBN: | 979-8-3503-4701-2![]() ![]() |
Collation: | str. 37-39 | URI: | https://enauka.gov.rs/handle/123456789/839153 https://cer.ihtm.bg.ac.rs/handle/123456789/6802 |
Project: | Ministarstvo prosvete, nauke i tehnološkog razvoja Republike Srbije, Ugovor br. 200026 (Univerzitet u Beogradu, Institut za hemiju, tehnologiju i metalurgiju - IHTM) | M-category: | Mp. category will be shown later |
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