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Title: Textile SIW structures without via holes using self-adhesive conductive tapes
Authors: Nešić, Dušan  ; Tanasković, Dragan  ; Vorkapić, Miloš  
Issue Date: 2023
Publication: Proceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbia
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Niš, Serbia : Faculty of Electronic Engineering, University of Niš
Type: Conference Paper
ISBN: 979-8-3503-4701-2 Search Idenfier
Collation: str. 37-39
URI: https://enauka.gov.rs/handle/123456789/839153
https://cer.ihtm.bg.ac.rs/handle/123456789/6802
Project: Ministarstvo prosvete, nauke i tehnološkog razvoja Republike Srbije, Ugovor br. 200026 (Univerzitet u Beogradu, Institut za hemiju, tehnologiju i metalurgiju - IHTM)
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