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Title: MEMS 封装技术:封装材料和 可靠性
MEMS Packaging: Material Requirements and Reliability
Authors: Stanimirović, Ivanka  ; Stanimirović, Zdravko  
Issue Date: 2015
Publication: Semiconductor manufacturing
ISSN: 1555-9270 Search Idenfier
Type: Article
Collation: vol. 16 br. 3 str. 34-38
URI: https://enauka.gov.rs/handle/123456789/970075
https://vinar.vin.bg.ac.rs/handle/123456789/14425
Availability note: Пуни текст није јавно доступан
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