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| Title: | Packaging and Reliability Issues in Microelectromechanical Systems | Authors: | Stanimirović, Ivanka |
Issue Date: | 2014 | Publication: | MIEL : 29th International Conference on Microelectronics : Proceedings book | ISSN: | 2159-1660![]() Search Idenfier |
Publisher: | IEEE | Type: | Conference Paper | ISBN: | 978-1-4799-5295-3 Search Idenfier |
Collation: | str. 333-336 | DOI: | 10.1109/MIEL.2014.6842157 | WoS-ID: | 000360788600071 | Scopus-ID: | 2-s2.0-84904659599 | URI: | http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=6842157&url=http%3A%2F%2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D6842157 https://enauka.gov.rs/handle/123456789/322821 |
Metadata source: | Migracija | Availability note: | Пуни текст није доступан ни у електронској, ни у штампаној форми | M-category: | Mp. category will be shown later |
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