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Title: Packaging and Reliability Issues in Microelectromechanical Systems
Authors: Stanimirović, Ivanka  ; Stanimirović, Zdravko  
Issue Date: 2014
Publication: MIEL : 29th International Conference on Microelectronics : Proceedings book
ISSN: 2159-1660 Search Idenfier
Publisher: IEEE
Type: Conference Paper
ISBN: 978-1-4799-5295-3 Search Idenfier
Collation: str. 333-336
DOI: 10.1109/MIEL.2014.6842157
WoS-ID: 000360788600071
Scopus-ID: 2-s2.0-84904659599
URI: http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=6842157&url=http%3A%2F%2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D6842157
https://enauka.gov.rs/handle/123456789/322821
Metadata source: Migracija
Availability note: Пуни текст није доступан ни у електронској, ни у штампаној форми
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