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Dynamics of the profile charging during SiO2 etching in plasma for high aspect ratio trenches
| Title: | Dynamics of the profile charging during SiO2 etching in plasma for high aspect ratio trenches | Authors: | Radjenovic, Branislav M |
Issue Date: | 2008 | Publication: | IEEE TRANSACTIONS ON PLASMA SCIENCE | ISSN: | 0093-3813 IEEE Transactions on Plasma Science Search Idenfier |
Type: | Article | Collation: | vol. 36 br. 4 str. 874-875 | DOI: | 10.1109/TPS.2008.920886 | WoS-ID: | 000258618200007 | Scopus-ID: | 2-s2.0-50249120526 | URI: | https://enauka.gov.rs/handle/123456789/816021 | Project: | Ministry of Science and Environmental Protection of Serbia [141025] | Metadata source: | (Preuzeto iz Nasi u WoS) | M-category: | 22M22 |
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