Results
eNauka >
Results >
The Effect of Tellurium Presence in Anodic Copper on Kinetics and Mechanism of Anodic Dissolution and Cathodic Deposition of Copper
| Title: | The Effect of Tellurium Presence in Anodic Copper on Kinetics and Mechanism of Anodic Dissolution and Cathodic Deposition of Copper | Authors: | Zvonimir Stanković; Vladimir Cvetkovski; Grekulović, Vesna   ; Vuković, Milovan V. ; Ivanov, Svetlana |
Issue Date: | 2013 | Publication: | International Journal of Electrochemical Science | ISSN: | 1452-3981 International Journal of Electrochemical Science Search Idenfier |
Publisher: | ESG (www.electrochemsci.org) | Type: | Article | Collation: | vol. 8 br. 5 str. 7274-7283 | WoS-ID: | 000319861000108 | URI: | https://enauka.gov.rs/handle/123456789/384608 | URL: | http://www.electrochemsci.org/papers/vol8/80507274.pdf | Metadata source: | Migrirano iz RIS podataka | M-category: | 21M21 |
1
WEB OF SCIENCETM
Items in eNauka are protected by copyright, with all rights reserved, unless otherwise indicated.