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Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates
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Title: | Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates | Authors: | Lamovec, Jelena ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() |
Issue Date: | 2010 | Publication: | 27th International Conference on Microelectronics, MIEL 2010 - Proceedings | Type: | Conference Paper | Collation: | str. 213-216 | DOI: | 10.1109/MIEL.2010.5490498 | Scopus-ID: | 2-s2.0-77955240918 | URI: | https://cer.ihtm.bg.ac.rs/handle/123456789/755 https://enauka.gov.rs/handle/123456789/439730 http://TechnoRep.tmf.bg.ac.rs/handle/123456789/1536 |
URL: | http://eds.ieee.org/conferences.html | Project: | Mikrosistemske, nanosistemske tehnologije i komponente (RS-11027) Dizajniranje nanokristalnih magnetnih materijala tipa (Nd,Pr)FeB i komponenti na bazi smart magnetnih materijala (RS-142035) |
M-category: | Mp. category will be shown later |
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