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The effect of nickel presence in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper
| Title: | The effect of nickel presence in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper | Authors: | Stankovic, Zvonimir D; Cvetkovski, Vladimir B; Rajcic-Vujasinovic, Mirjana M | Issue Date: | 2001 | Publication: | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | ISSN: | 0013-4651 Journal of the Electrochemical Society Search Idenfier |
Type: | Article | Collation: | vol. 148 br. 6 str. C443-C443 | DOI: | 10.1149/1.1372214 | WoS-ID: | 000169131500037 | Scopus-ID: | 2-s2.0-1542465719 | URI: | https://enauka.gov.rs/handle/123456789/799805 | Metadata source: | (Preuzeto iz Nasi u WoS) | M-category: | 21aM21a |
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