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eNauka >  Rezultati >  The effect of nickel presence in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper
Naziv: The effect of nickel presence in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper
Autori: Stankovic, Zvonimir D; Cvetkovski, Vladimir B; Rajcic-Vujasinovic, Mirjana M
Godina: 2001
Publikacija: JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN: 0013-4651 Journal of the Electrochemical Society Pretraži identifikator
Tip rezultata: Naučni članak
Kolacija: vol. 148 br. 6 str. C443-C443
DOI: 10.1149/1.1372214
WoS-ID: 000169131500037
Scopus-ID: 2-s2.0-1542465719
URI: https://enauka.gov.rs/handle/123456789/799805
Izvor metapodataka: (Preuzeto iz Nasi u WoS)
M-kategorija: 
21aM21a - Vodeći međunarodni časopis kategorije M21a

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